Wafer Pattern Defect Inspection Systems

・Main Target Devices: MEMS, Power, Analog
・Various Device Wafer: Inspection of appearance defects such as film deposition, resist development, and pattern defects after etching.
(Target Wafer Materials: Si, SiC, GaN, InP, LT/LN, Glass, Resin)

Candidate Introduction Inspection Process

・Surface：Scratches, cracks, dimples, chippings, protrusions, particles, dirt, diffraction, blemishes and irregularities

High-Speed, High-Sensitivity Inspection

Utilizing a specially developed ultra-high-resolution coaxial illumination camera, it is possible to rapidly detect and classify minute defects on wiring patterns.

Advanced Defect Classification

Through ultra-fast inspection and real-time image recognition and classification capabilities, it is possible to conduct full-chip inspection within the wafer surface, which was previously challenging, and to detect and classify defects in real-time. Additionally, automatic classification customized for each sample based on other defect detection conditions is possible.

Automation of OK/NG Determination

Utilizing dedicated software for image processing, it is possible to generate samples of good chips from the inspection data of the target chips and automate the determination of OK/NG.

Offline Review Function

Equipped with an offline review function for imported inspection data and image processing data.

For customers who would like to use this inspection system to check surface conditions or defects, it is possible to borrow a sample of the workpiece to be inspected and carry out a preliminary evaluation using a demonstration machine. Please contact us to discuss your requirements.

Power Semiconductor

Power semiconductors are semiconductor devices used to control high voltage and large current, widely employed in power conversion and power control, essential for applications such as electric vehicles and renewable energy.

Legacy Node

Legacy nodes refer to older-generation technologies in semiconductor manufacturing with wider manufacturing process ranges (e.g., 90nm and above) than the latest technologies. They offer better cost efficiency compared to cutting-edge applications and are widely used in many existing products.

Analog Semiconductor

Analog semiconductors are a collective term for semiconductor devices that electronically measure analog signals (such as audio signals, temperature, and light intensity) and convert them into digital signals.

MEMS

MEMS (Micro Electro Mechanical Systems) refer to miniature mechanical components and electronic circuits manufactured using semiconductor manufacturing microfabrication techniques. They are applied in electronic devices such as sensors and actuators.

IoT

IoT (Internet of Things) refers to miniature mechanical components and electronic circuits manufactured using semiconductor manufacturing microfabrication techniques. They are applied in electronic devices such as sensors and actuators.

XR

XR (Extended Reality) is a collective term for technologies that provide experiences by merging real and virtual environments, including AR, VR, and MR.