LT/LN Wafer Defect Inspection Equipment

・Final inspection of LT/LN wafers
・Inspection after grinding
・Inspection after polishing

Candidate Introduction Inspection Process

・Surface：Scratch, particles, color unevenness, cracks, chipping, dirt, cleaning marks, polishing marks, grinding marks

・Internal：Pinholes

・Back Surface：Scratch, cracks, dirt

・Edge：Chipping, cracks, dirt

High-Speed, High-Sensitivity Inspection

Dedicated line sensor camera and specialized light source for high-speed scanning and defect extraction of LT/LN wafers up to 200mm. Accurate inspection is possible even on highly transparent wafers without being affected by the inspection stage.

Advanced Defect Classification

Automatic classification of typical defects on the surface and backside of LT/LN wafers.

Inspection of Both Front and Back Sides with a Single Unit

Multi-inspection of front surface, back surface, and edge surface with a single unit.

Optimization of Parameters

Optimization of parameters tailored to the criteria of good wafers to suppress undetected and over-detected target defects.

Color Variation Detection

It is possible to perform selection based on the degree of variation such as color variation and quantification of the variation.

For customers who would like to use this inspection system to check surface conditions or defects, it is possible to borrow a sample of the workpiece to be inspected and carry out a preliminary evaluation using a demonstration machine. Please contact us to discuss your requirements.

LT, LN Wafers

LT and LN wafers are single-crystal oxide wafers, referring to Lithium Tantalate and Lithium Niobate, respectively. These wafers can be grown via the Czochralski method (Cz method) and are suitable for mass production, similar to silicon wafers. Additionally, processing of these wafers can be performed using methods similar to those used for silicon.

SAW Devices

SAW devices, short for Surface Acoustic Wave devices, are essential high-frequency filters used in wireless communication terminals such as smartphones. These devices consist of electrodes and reflection patterns formed on piezoelectric crystal substrates. They allow for the selective extraction of electrical signals at specific frequencies.