Inspection

• SiC Latent Defect Expansion Inspection Device（UV-EVI：UV Expand Visualize Inspection)

• Silicon Wafer Defect Inspection System

• SiC Wafer Defect Inspection System

• LT/LN Wafer Defect Inspection System

• Glass Wafer Defect Inspection System

• Wafer Pattern Defect Inspection Systems

• SiC Latent Defect Expansion Inspection Device（UV-EVI：UV Expand Visualize Inspection)

  SiC devices are gaining attention as energy-saving materials, but bipolar degradation has become a recent technical issue.
  This phenomenon occurs when repeated current flow causes BPD defects within the substrate to expand, eventually leading to device failure. Latent BPDs are difficult to detect with standard inspections, and even when changing materials or device structures as a countermeasure, sample testing takes about two months, making rapid response challenging.
  Therefore, we have developed a device that can reproduce bipolar degradation through UV laser irradiation and visualize latent defects at the wafer level.
  This product is a joint development with Aites Co., Ltd.

  

• Silicon Wafer Defect Inspection System

  The Si wafer defect inspection device uses advanced optical technology to swiftly and sensitively detect defects on both bare and patterned wafers, enabling high-speed, high-sensitivity inspection. With its high throughput, it automates full-scale inspection, replacing traditional visual methods.

  

• SiC Wafer Defect Inspection System

  Wide bandgap semiconductors, including SiC, are crucial for power semiconductor control, offering higher efficiency than traditional Si semiconductors and facilitating Green Transformation (GX). As demand surges, especially for EV power control, we're advancing to 8-inch production. Our enhanced wafer appearance inspection equipment, originally developed for Si, now benefits SiC, aiding in solving customer challenges.

  

• LT/LN Wafer Defect Inspection System

  LT and LN wafers are mainly used for SAW devices in wireless communication terminals like smartphones. These devices act as crucial filters to prevent noise and interference during voice and data communication. With increasing production and size scaling, the demand for SAW devices is expected to rise, highlighting the growing importance of automated appearance inspection.

  

• Glass Wafer Defect Inspection System

  Glass is crucial in semiconductor manufacturing due to its flatness, smoothness, and thermal properties similar to silicon. It serves as a support substrate for wafer-level packaging and silicon wafer thinning. Fine-pitched Through-Glass Vias (TGVs) enable high-density TGV formation, enhancing semiconductor performance.
  

  

• Wafer Pattern Defect Inspection Systems

  The semiconductor shortage is partly due to supply constraints in legacy nodes, which produce diverse products in small quantities using depreciated equipment. With increasing demand from next-generation devices like IoT, automotive EVs, and XR, bolstering production capacity is crucial. We offer advanced legacy node device inspection equipment, integrating the latest hardware and software inspection technologies, to help address these challenges.